High-Speed Digital Design Engineer

About viaPhoton

We are changing the norm by being customer-focused, technology-led.

viaPhoton builds custom-engineered fiber optic solutions that power AI infrastructure, data centers, and 5G networks for some of the biggest names in tech. In five years we've grown to a team of 200+ and 4x'd our revenue in the last year alone, and we're just getting started. We're looking for dependable, hardworking people who take pride in their work and want to grow with us.

About the Role

You'll advance the development of 200G+ systems and interfaces for our next-generation Co-Packaged Optics (CPO) products, owning the high-speed electrical data path from concept to production. This is deep, hands-on signal and power integrity work at the cutting edge of AI data center connectivity, and you'll guide and mentor junior engineers along the way.

• Advance the development of 200G+ systems and interfaces for our NPO and CPO products, including 224G/448G PAM4 signal and power integrity (SIPI) • Own technology selection, architecture, development, integration, and productization of cutting-edge CPO solutions • Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance • Assess host (switch fabric and xPU) and optical technologies, including compute fabrics and scale-up/scale-out topologies • Guide the electrical data path from concept to production, and mentor junior design team members

What You'll Bring

• Have a BS in…